JPH0217837U - - Google Patents
Info
- Publication number
- JPH0217837U JPH0217837U JP1988096096U JP9609688U JPH0217837U JP H0217837 U JPH0217837 U JP H0217837U JP 1988096096 U JP1988096096 U JP 1988096096U JP 9609688 U JP9609688 U JP 9609688U JP H0217837 U JPH0217837 U JP H0217837U
- Authority
- JP
- Japan
- Prior art keywords
- disk
- light detection
- feed amount
- solder
- detection patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims 2
- 239000000835 fiber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096096U JPH0217837U (en]) | 1988-07-20 | 1988-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096096U JPH0217837U (en]) | 1988-07-20 | 1988-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217837U true JPH0217837U (en]) | 1990-02-06 |
Family
ID=31320904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988096096U Pending JPH0217837U (en]) | 1988-07-20 | 1988-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217837U (en]) |
-
1988
- 1988-07-20 JP JP1988096096U patent/JPH0217837U/ja active Pending